Laser licence deal meets business target

NanoVia has closed an exclusive deal on its CO2-laser-based HyperVia microvia drilling technology.

NanoVia has closed an exclusive deal on its CO2-laser-based HyperVia microvia drilling technology.

NanoVia has always positioned itself in growth market areas and with this latest agreement NanoVia has accomplished its 2002 goals for licensing within its High Density Interconnect Business Unit.

With the CO2 iteration of its HyperVia optical system wrapped up, NanoVia is now poised to charge into the field of memory repair and yield management to directly challenge its US competitors through strategic alliances, partnerships and joint venture opportunities.

The most likely targets of these relationships are semiconductor tool builders who recognize that laser yield management is imperative, especially as the semiconductor market ramps up the 100-million-plus transistor level in memory and processors.

The implementation of 300mm wafer sizes will only serve to increase this need, as well.

Non-laser system manufacturers have seen a great opportunity to enter this market by way of a NanoVia partnership.

The VectorLinx technology has been tested and its R and D results show a potential for threefold throughput increase for standard memory fuse link trimming applications, with a possible doubling of that speed within a few years.

"Leveraging our optical and laser solutions knowhow with existing manufacturers of semiconductor processing equipment is our goal", explains Todd Lizotte, Vice President of R and D at NanoVia, LP.

"We believe the laser yield management equipment providers are not keeping pace with the innovation required to serve the semiconductor market.

The United States must keep pace as a developer of new technology, and with transistor densities approaching the 1 billion mark within the next 10 years, the semiconductor industry needs equipment providers willing to make innovation the top priority.

This is our quest".

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