Product category:
Power Supply ICs and Controllers
News Release from: National Semiconductor | Subject: LP2989 LDO
Edited by the Electronicstalk Editorial
Team on 06 February 2001
Leadless leadframe package shrinks LDO
National Semiconductor has introduced a full-featured 500mA LDO regulator for medium-current applications in computing devices and portable products.
National Semiconductor has introduced a full-featured 500mA low dropout (LDO) voltage regulator for medium-level current applications in computing devices and portable products requiring low-noise voltage conversion The precise micropower LP2989, housed in a chip-scale, leadless leadframe power package (LLP), is designed to fit the tight space requirements of compact portable designs
This article was originally published on Electronicstalk on 5 Jan 2001 at 8.00am (UK)
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The LLP package measures just 4.0 x 4.0mm, has a low profile of 0.8mm, and a pin pitch of just 0.8mm.
Power dissipation, measured by theta j-a, is a low 78C/W.
Typical applications for the LP2989 include information appliances and networking products, DSPs and cell-phone audio subsystems.
Besides a guaranteed 500mA continuous output current, the feature set for the fixed-output LP2989 begins with an ultra-low dropout voltage of 310mV at a 500mA load and 150mV at a 200mA load (typical).
Output noise is a low 18uV.
Ground pin current is typically 1mA at 200mA loads and 3mA at 500mA loads, respectively.
For users wanting to manage power dynamically in the system, the device contains logic-controlled on/off.
Quiescent current drops to less than 1uA in shutdown mode.
Voltage options range from 1.5 to 5V.
The precise output voltage is +/-1.5% at room temperature over load and line variations.
The LP2989 includes an error flag that goes low when the output drops 5% below nominal.
As with all National Semiconductor LDO regulators with error flags, the LP2989 can be used in wake-on-LAN applications.
It also contains protection for overtemperature and overcurrent conditions.
In addition to the leadless leadframe package, the device is housed in eight-lead SOIC or mini-SOIC surface mount packages.
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