Product category:
Standard Logic Devices
News Release from: National Semiconductor
Edited by the Electronicstalk Editorial
Team on 23 January 2002
National and Texas collaborate on bus
transceivers
National Semiconductor and Texas Instruments are to develop a family of footprint-compatible bus transceivers compliant with the new multipoint low-voltage differential signalling standard.
National Semiconductor and Texas Instruments are to develop a family of footprint-compatible bus transceivers compliant with the newly published multipoint low-voltage differential signalling (M-LVDS) standard New M-LVDS devices from both National and TI will increase signalling rates five fold over existing single-ended backplane technologies, making them ideal for a wide range of high-speed, low-power communications applications such as wireless basestations, telecomms digital cross-connect data carriers, storage and clock distribution
This article was originally published on Electronicstalk on 5 Jan 2001 at 8.00am (UK)
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Designers will benefit from the two companies' collaboration on common footprints and alternate sourcing.
National and TI have agreed to the inclusion of the 75176, 75180, 34050, 34051, LV047 and LV048 industry-standard footprints on their M-LVDS product roadmaps to provide low-power, low electromagnetic interference (EMI) and high-speed upgrades to existing components.
M-LVDS is an evolution of the TIA/EIA-644 Low-Voltage Differential Signalling standard that enables multidriver connections on a shared bus for multipoint (double termination) applications.
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The recently approved TIA (Telecommunications Industry Association)/EIA (Electronic Industries Alliance) M-LVDS specification (TIA/EIA-899-2001) specifies up to 32 nodes to be connected on a shared bus for data signalling rates up to 500Mbit/s.
The standard provides the electrical-layer specifications and design guidelines for multidrop and multipoint databuses.
Extending LVDS to the multipoint application space will allow customers to build National and TI LVDS product offerings into more diverse applications.
"M-LVDS is the only general-purpose interface standard that offers hundreds of megabits per second signalling rates, supports multipoint buses, tolerates 1V of common-mode noise, and that will have industry standard footprint compatible products from the two largest interface IC suppliers in the world", said Peter Peisker, analogue market development manager for TI in Europe.
"This is a powerful set of attributes that translates into reduced cost, time to market and widespread availability benefits for all our customers".
"The standardisation of M-LVDS will provide a new catalyst for the growth of the LVDS technology," said Alan Hutton, product marketing manager in the Wired Communications division at National Semiconductor in Europe.
"We are delighted to work with TI to push for this new standard for M-LVDS that will open up new applications that demand increased data bandwidth and lowered power consumption.
Customers will also be safe in the knowledge that there is also multiple sourcing of components".
A leading-edge technology providing high-speed data transmission for backplane and cable applications, M-LVDS requires little power, is high-speed and is very robust.
M-LVDS offers a high-speed, low-power upgrade to the TIA/EIA-485 multipoint standard that is used in many applications including industrial control networks and storage applications.
This new application focus is being standardised by TIA/EIA and will be published soon as TIA/EIA-899-2001.
Product information on new families of M-LVDS devices from both National Semiconductor and TI compliant with the proposed TIA/EIA-899 specification are available now on the companies' respective websites.
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