Lead-free programme nears full coverage

National Semiconductor reckons it is on track to achieving 100% lead-free production by the end of June 2006, at which point all the company's ICs will be sold in lead-free packages.

National Semiconductor reckons it is on track to achieving 100% lead-free production by the end of June 2006, at which point all the company's ICs will be sold in lead-free packages.

The aggressive initiative is part of an industry-leading effort to make more environmentally neutral electronic components, protect the environment and facilitate recycling.

In addition to eliminating lead, National has also significantly reduced bromine and antimony-based flame-retardants from its packaging processes.

In April 2004, National announced its intention to offer lead-free packages for its complete line of ICs, and its product portfolio of 15,000 analogue and mixed-signal ICs is currently available in lead-free packages.

At the end of June 2006, when National's entire product offering will be sold lead-free (unless deemed exempt), the company will be fully compliant with the Restriction of Hazardous Substances (RoHS) Directive enacted by the European Parliament.

However, National's lead reduction goals are substantially more aggressive than those in countries where the company does business.

Lead was formerly used in the plating finish of copper-leadframe-based packages.

It was also used in the solder balls of array packages such as micro SMD, PBGA and FBGA packages.

National has replaced the lead in leadframe packages with a matte tin finish, and in the solder balls with a tin-silver-copper alloy for micro SMD and tin-silver for PBGA and FBGA packages.

Once this aggressive programme is fully implemented, National expects to replace approximately five tonnes of lead used per year.

"As a leader in lead-free packaging technology, National is extending its effort to make innovative high-performance products that are environmentally friendly and easier to recycle", said Kamal Aggarwal, Executive Vice President, Central Technology Manufacturing Group at National.

Packaging is a critical part of the semiconductor manufacturing process.

National's advanced package technologies enable its customers to build cellphones, displays, laptop computers, and many other electronic products that are small, thin, lightweight, and have long-lasting battery life.

National has led the market in packaging innovations for years with the introduction of revolutionary micro SMD and leadless leadframe packaging (LLP) technologies.

Today, about one-seventh of all chip scale packages manufactured worldwide are provided by National.

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