Product category:
Analogue and Mixed Signal ICs
News Release from: National Semiconductor | Subject: Micro SMDxt packaging
Edited by the Electronicstalk Editorial
Team on 11 January 2006
Micro chip package promises major space
savings
The micro SMDxt (micro surface mount device extended technology) chip package, is the latest generation of wafer-level package technologies.
Continuing decades of packaging innovation, National Semiconductor has developed the micro SMDxt (micro surface mount device extended technology) chip package, the company's newest generation of wafer-level package technologies The new package, which builds on National's highly successful micro SMD, uses a unique structure that enables high-reliability products with bump counts of 42 to 100 bumps at a 0.5mm pitch without any underfill
This article was originally published on Electronicstalk on 5 Jan 2001 at 8.00am (UK)
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Higher bump-count packages enable designers to create more complex products with advanced features and pack them into a smaller space.
(Pitch is the distance between bumps: first-generation micro SMD products featured packages with bump counts up to 36 and pitch of 0.5mm).
"National leads the industry in package miniaturisation for applications such as cell phones, notebook computers and other portable devices", said Sadanand Patil, Vice President of National's Package Technology Group.
"The new micro SMDxt package offers the industry's smallest footprint and improved performance while using standard surface mount assembly and rework processes".
The superior electrical noise performance of this package (compared with standard wire-bonded devices) makes it well-suited for high-performance mobile applications.
Thermal performance of micro SMDxt packages is comparable to other thermally enhanced packages such as QFN or leadless leadframe packages with similar pin count.
Reliability standards such as thermal cycling, thermal shock, drop test and flex test can be met without the use of an underfill.
The first product that uses the innovative package is the LM4934 Boomer stereo audio subsystem in the 42-bump micro SMDxt.
National has also introduced the LM4935, a new complete Boomer audio subsystem with a mono Class D speaker driver.
Packaged in a 49-bump micro SMDxt, the new LM4935 requires 70% less board space than existing solutions.
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