Product category:
Heatsinks and Thermal Management
News Release from: Nexus Technology | Subject: HXR-5500
Edited by the Electronicstalk Editorial
Team on 19 February 2008
Memory coolers take heat pipes onboard
Heat pipe efficiently transports the heat from the memory module onto the detached aluminium heatsink on top of the module.
More then 7 years ago Nexus introduced a patented heat spreader cooler for PC memory modules At first just in aluminium, but later on also in copper and even in copper with a nickel or gold plating, many memory module makers adopted this cooler and it soon became the industry standard for high-end memory modules
This article was originally published on Electronicstalk on 4 Mar 2005 at 8.00am (UK)
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Nexus has released its thermal management solution for the latest Intel Socket T LGA 775 processors.
Now Nexus is looking to set another new standard with the launch of a new series of memory coolers with integrated heat pipes: the HXR-5500.
The aluminium extrusion heatsinks of the HXR-5500 have an integrated heat pipe of 5mm diameter.
The heat pipe efficiently transports the heat from the memory module onto the detached aluminium heatsink on top of the module.
Tests show that this heat pipe cooler improves the memory module temperature by 13 to 14C compared with simple stock heat spreaders.
It is needless to say that 14C in the computer world is a huge gap.
Surely this great cooling result will push memory module makers to integrate this solution with their products.
And for end-users that want to boost the cooling of their current modules Nexus offers the heat pipe heat spreaders through its distributor and reseller network.
These heat spreaders carry the model name HXR-5500 and are available in black, blue and plain aluminium.
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