Product category:
Capacitors
News Release from: NIC Components Europe | Subject: NASE, NAWE, NAWT, NAZK, NAZT and NAZU series
Edited by the Electronicstalk Editorial
Team on 20 November 2006
Chip capacitors handle the heat of
reflow
NIC Components has introduced six new series of SMT V-Chip capacitors that feature +260C soldering heat ratings.
NIC Components has introduced six new series of SMT V-Chip capacitors that feature +260C soldering heat ratings The liquid electrolyte, aluminium electrolytic devices are able to withstand the requirements of Sn-Ag-Cu (SAC) alloy lead-free soldering process
This article was originally published on Electronicstalk on 23 Mar 2001 at 8.00am (UK)
Related stories
Capacitor arrays have reduced trace distances
Now available from NIC Components, a range of 0805 size ceramic chip capacitor arrays that feature reduced trace distance, improving performance for high-speed applications.
Chip inductors save space in high-current designs
A new series of SMT inductors from NIC Components features inductance values from 3.3nH to 4.7uH in package sizes down to 0805.
SAC solder alloys have emerged as the industry standard replacement for Sn-Pb solder alloys that were used extensively prior to the implementation of RoHS legislation earlier in 2006.
The new NASE, NAWE, NAWT, NAZK, NAZT and NAZU series, from NIC, provide designers with an extensive choice of devices for use in applications that demand characteristics such as low ESR, wide operating temperature range, small form factors as well as general purpose styles.
Available case diameters for +260C soldering heat rated capacitors are 4, 5, 6.3 and 8mm.
Larger case sizes, 10, 12.5 and 16mm, are rated from +250, +240 and +235C, respectively.
These new series from NIC cover voltage ratings of between 6.3 and 50V DC, and capacitance values from 0.1 to 6800uF.
Load life ratings from 1000 to 5000 hours at maximum rated temperature.
Common SAC solder alloys have a melting point of 217C.
A peak reflow soldering temperature of 12 to 43C above the melting point is typically recommended in order to achieve good wetting and to form a quality solder joint.
The time above melting point should be between 30 and 90s, depending on the application/assembly.
All of the new ranges of parts are supplied in tape and reel packaging for automatic placement and reflow soldering.
• NIC Components Europe: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

