Nihon releases the SN100C lead-free solder spheres
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Nihon Superior product story
Edited by the Electronicstalk editorial team
Jan 26, 2009
Nihon Superior's SN100C lead-free solder spheres feature excellent impact strength, making them extremely reliable.
They are suitable for BGA, CSP, MCM and high-density fine-pitch applications.
SN100C spheres have a smooth surface, free of shrinkage effects.
The spheres' high ductility ensures high impact strength.
Additional features include stable intermetallic compound and slow growth of interfacial intermetallic.
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