Inspection system checks for cracked joints

To improve the quality of the solder joint evaluation reports it provides to its customers in the electronics industry, Tin Technology has invested in new digital imaging technology from Nikon.

In order to improve the quality of the solder joint evaluation reports it provides to its customers in the electronics industry, Tin Technology has invested in new digital imaging technology from Nikon.

The arrival of a new Nikon imaging inspection system, incorporating an L200 microscope, ultra-high-resolution digital camera and advanced image analysis software, means that the world's foremost authority on tin can not only capture images digitally and export them directly into its reports, but also measure accurately coating thicknesses and distances between different phases.

Typically, samples will be cut from failed electronic circuit boards and Tin Technology will be asked to look for either cracked joints within specially prepared microsections or for component misalignments.

Samples from product development programmes are also regularly submitted for inspection.

Having relied previously on Nikon kit, Wayne Lam, Senior Materials Engineer at Tin Technology said: "Since our original set up had served us extremely well over many years, we were always going to consider Nikon first".

"However, we did not realise how much of an improvement there would be with the latest optics and, compared with other options, we found sticking with Nikon to be the best solution".

"The upgrade has provided us with higher quality images and we now have the ability to document and measure the defects we are asked to identify and report on".

"Previously, we had to rely on a CCTV for image capture, but now we just click the mouse and capture areas of interest at a resolution of 12 million pixels".

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