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News Release from: National Physical Laboratory
Edited by the Electronicstalk Editorial
Team on 07 December 2004
Masterclass extols benefits of embedded
passives
At the recent NPL Masterclass, Dr Richard Ulrich gave a comprehensive discourse on the current and future benefits of embedded passives.
At the recent NPL Masterclass, part of the ongoing series inviting world-class presenters to Teddington, Dr Richard Ulrich, the international recognised expert and author of the book ?Integrated passive component technology?, gave a comprehensive discourse on the current and future benefits of embedded passives A major driver today for embedded passives is the need for decoupling; currently many discrete capacitors are arrayed around microprocessors, taking up PCB area and adding inductance
This article was originally published on Electronicstalk on 2 Jan 2008 at 8.00am (UK)
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Guidance on potential benefits and design criteria were discussed.
Dr Ulrich reported a major hurdle to be overcome is with material developments and the incorporation of embedded passive features into PCB design software, and for PCB shops to take on board the necessary fabrication facilities.
Ulrich outlined the types of products that currently feature embedded technology; many are household names and have used these materials for the last 5 years.
It's also interesting that the use of printed resistors will be one of the technologies to be adopted, it's simple, cost effective and there is a great deal of process knowledge in the printed board industry.
After all, printed polymer inks have been in use for the last 20 years in different applications and go in and out of favour.
Embedded components will have an impact on board technology but also on SMT component placement, fewer parts to place means faster throughput speed in production and less passive parts on the surface of the board.
This leaves more room for the design engineer to include more active circuitry.
Dr Ulrich is located at The High Density Electronics Centre, University of Arkansas and is a member of the National Electronics Manufacturer's Institute (NEMI) Committee on Future Technologies.
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