Novel instrument measures solder properties

The National Physical Laboratory has developed a new instrument for measuring solder properties.

The National Physical Laboratory has developed a new instrument for measuring solder properties.

With the take up of the new lead-free alloys there is an imperative to obtain accurate material properties.

Today there is a realisation that these properties must be measured on volumes of materials typical of current solder joints (less than 1mm3).

This requirement is challenging in terms of instrument sensitivity, requiring the ability to measure and displace small distances, typically a few microns to a precision of 0.1um, and to measure low forces.

NPL has developed a machine that achieves this capability and is based on a novel configuration.

Measurements are now possible at typical stresses and strains found in solder joints, resulting in realistic fatigue and creep rates to be measured.

These values are essential for accurate statistically based lifetime predictions of lead-free reliability.

This work has been carried out at NPL by Milos Dusek and Crispin Allen.

Back to top