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News Release from: National Physical Laboratory
Edited by the Electronicstalk Editorial
Team on 13 December 2004
Project to test today's PCBs on Pb-free
lines
A new NPL studio project will investigate the reliability of existing substrates manufactured using a lead-free process.
The National Physical Laboratory will shortly start a new studio project and welcomes interest from potential partners, especial manufacturers with high reliability concerns, printed circuit board and laminate suppliers The aim of this project is to investigate the reliability of existing substrates manufactured using a lead-free process
This article was originally published on Electronicstalk on 2 Jan 2008 at 8.00am (UK)
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This project will include investigation of the reliability of microvias, nonfunctional pads and the design/build aspects of the substrate.
The project will also investigate these substrates in terms of conductive anodic filamentation (CAF) susceptibility.
Following lead-free processing circuit boards will be stressed using both thermal cycling and an electrical test method.
The electrical test method is an IST interconnect stress test that is fast, environmentally friendly and includes automatic data logging.
The test vehicle design will comprise a number of features that will also include board supplier properties.
NPL (with its partners) will design a test vehicle and carry out reliability tests to come up with a new test method for assessing circuit boards with a lead-free profile.
The time frame is to launch this project within 3 months and complete within 9-12 months.
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