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News Release from: National Physical Laboratory
Edited by the Electronicstalk Editorial
Team on 08 April 2005
New technique to assess whisker growth
A new report that highlights the progress made in a project aimed at formulating a practical test method for measuring the internal stresses in the coatings of electronic components.
The National Physical Laboratory has launched a report that highlights the progress made in Phase 2 of a studio project aimed at formulating a practical test method for measuring the internal stresses in the coatings of electronic components, based on the XRD technique The work is driven by the necessity to be able to assess the potential of whisker growth (generated from internal stresses) from new lead-free finishes for these components
This article was originally published on Electronicstalk on 2 Jan 2008 at 8.00am (UK)
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Such finishes are being explored in the light of the forthcoming ban on the use of lead.
XRD measurement did show some correlation of measured compressive residual stress on coatings with whisker growth.
Three coatings with high compressive residual stress also exhibited whiskering.
However, the coatings evaluated were all at least twice as thick as penetration depth of the XRD measurement system, and the measured compressive residual stress values did not start to increase until after the formation of tin whiskers.
However, the XRD method did provide some correlation between residual stress in the coatings and the extent of whisker growth.
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