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News Release from: National Physical Laboratory
Edited by the Electronicstalk Editorial
Team on 08 March 2006
Contamination study is top paper at APEX
Christopher Hunt and Martin Wickham have been awarded the Best International Conference Paper at IPC Printed Circuits Expo, APEX and the Designers Summit 2006.
For their presentation of the paper "Impact of lead contamination on reliability of lead-free alloys", Christopher Hunt, PhD, and Martin Wickham, from the National Physical Laboratory, have been awarded the Best International Conference Paper at IPC Printed Circuits Expo, APEX and the Designers Summit 2006 The award was made by Peter Murphy, Chairman of the Board - IPC, President and CEO of Astrodyne Corporation at a luncheon in Anaheim, California
This article was originally published on Electronicstalk on 2 Jan 2008 at 8.00am (UK)
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Hunt presented his paper on the Friday of APEX in a lead-free reliability session.
The reliability of solder joints made using lead-free solders, should not be compromised by the presence of small amounts of lead (emanating, say, from stock components having terminations containing lead).
This is a major and welcome finding of an extensive investigation carried out by NPL in collaboration with fifteen industrial collaborators on work sponsored by the UK Department of Trade and Industry.
Over 200,000 solder joints on special test assemblies incorporating the main types of surface mount and through-hole components were manufactured using SnPb, lead-free and mixed alloy systems.
The results clearly indicate that there are no real issues regarding solder joint reliability when using lead-free and SnPb-terminated components and lead-free solders, even if the lead content reaches 10%.
The conclusions should dispel the industry concern about any reliability risks.
Another piece of good news coming from this project is that BGA joints soldered using SAC alloy are markedly more reliable in terms of fatigue resistance, than those of the traditional benchmark SnPb-finished components assembled using SnPb solder.
A full version of the report is available on the NPL website.
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