Product category:
Embedded Computing and Control
News Release from: Nexcom UK | Subject: ICES 300
Edited by the Electronicstalk Editorial
Team on 27 November 2007
COM Express module boosts embedded
bandwidth
Billed as the next development in embedded computing, the ICES 300 is a Core 2 Duo based COM Express module from Nexcom.
The small and rugged ICES 300 is a Type 2 COM Express module featuring the Intel GM965 and ICH8M chipset, which supports Intel Core 2 Duo Merom and Core 2 Duo Merom LV processors with 667/800MHz FSB In addition, it also supports two banks of DDR2 memory, accommodating up to 4Gbyte at 533/677MHz
This article was originally published on Electronicstalk on 25 Feb 2003 at 8.00am (UK)
Related stories
Budget price for Pentium 4 SBC
The Peak 715VL Series SBC supports the Intel socket 478 Pentium 4 CPU with 400/533MHz system bus operating at up to 2.8GHz, and is available at very competitive prices for OEMs and system integrators.
Server hosts up to eight Opteron-based blades
The NexBlade HS416 is powered by an AMD Opteron 64bit processor for cost effective, high performance blade solutions to a broad spectrum of IT applications.
The ICES 300 COM Express offers high processing power and vivid graphic display solutions for advanced embedded applications.
The ICES 300 will be used within media-rich gaming platforms, kiosks, digital signage, surveillance/security systems, military and medical applications.
The small and rugged ICES 300 module uses the new small-form-factor COM Express standard for to reduce time to market, cut development costs and minimise risk.
This concept enables the engineer to focus entirely on system I/O development without altering the entire system board layout, thus greatly reducing the total engineering time, cost and risk.
As the bandwidth of legacy peripheral such as PCI-X and AGP no longer satisfies the requirements of today's business applications, the COM methodology has become the widely accepted industrial standard.
COM Express products such as the ICES 300 enable developers to implement the new peripherals with increased bandwidth and to take the advantage of performance gain from CPUs and chipsets, such as PCIe and SATA.
Integrated with Intel Extreme Graphics 2 technology, the ICES 300 COM Express supports a PCI Express x16 interface for superb graphic display through the carried board.
It also supports other display types include LFP, LVDS, and wide screens up to 1920 x 1200.
The high performance ICES 300 COM Express module is compatible with ICEB 8050 evaluation carrier board, which supports three SATA interfaces, eight USB 2.0 interfaces and five PCIe x1 lanes through the carried board. Request a free brochure from Nexcom UK ...
• Nexcom UK: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page

