Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Oki Electric
Edited by the Electronicstalk Editorial
Team on 21 November 2002
New process puts Oki on target for
lead-free ICs
Oki Electric has developed a lead-free solder plating technology for semiconductor package terminals.
Oki Electric has developed a lead-free solder plating technology for semiconductor package terminals Introducing this technology at its production facilities will allow the company to implement totally lead-free LSI production at all its semiconductor production bases around the world
This article was originally published on Electronicstalk on 10 Apr 2002 at 8.00am (UK)
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"We will advance steadily toward our target: namely, to provide totally lead-free products on the market by the end of the fiscal year ending March 2004.
This is just one of the wide-ranging environmental activities that represent Oki's group-wide commitment to environmental protection", said Masayoshi Ino, Executive Vice President at Oki Electric, responsible for the group's environmental protection strategies.
Oki has been developing its environmental protection programmes since 1993, reflecting its high priority on environmental activities in corporate management policies throughout its group companies.
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As part of its "Oki Eco Plan 21" set forth in 2001, it set a goal of totally lead-free soldering for all products manufactured in Japan by the end of the fiscal year ending March 2004.
The company has already completed the development of lead-free soldering to mount semiconductors to printed circuit boards, and wholly owned subsidiary Nagano Oki Electric has begun mass production of lead-free soldered boards.
The technique developed by Oki involves a lead-free solder plating technology for semiconductor package terminals.
There are two types for soldering terminals: a solder plating for the outer lead frame, and soldering of solder balls.
Oki has selected Sn-Bi (tin, bismuth) for plating the outer lead frame and Sn-Ag-Cu (tin, silver, copper) for solder balls.
These materials provide reasonable cost and quality and reliability higher than or equal to conventional Sn-Pb (tin, lead) materials.
These materials do present the challenge of higher melting temperature, necessitating greater heat resistance in certain device components.
In response, the company took several measures, including the adoption of high heat-resistant mould resins, which enabled the success of reliable lead-free soldering.
Oki has confirmed the reliability of its lead-free soldering technology by implementing reliability tests for the major types of outer lead frames for semiconductor packages, including DIP (dual inline package), QFP (quad flat package), and SOP (small outline package), and also BGA (ball grid array) and CSP (chip scale package) types of ball-type semiconductor packages.
The tests were conducted according to the conditions of the lead-free project defined by JEITA (Japan Electronics and Information Technology Industries Association).
The company has introduced lead-free plating equipment based on this technology in the assembly processes of production facilities, including Miyazaki Oki Electric and Oki (Thailand), as well as their business partners.
These companies began mass production of lead-free semiconductor products in response to customer requests.
Oki intends to expand lead-free reliability testing to various products to make all types of semiconductors lead-free by the end of March 2003.
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