Product category:
Analogue and Mixed Signal ICs
News Release from: Oki Electric | Subject: ML2864
Edited by the Electronicstalk Editorial
Team on 02 December 2003
Polyphonic chip sounds a good idea for
handsets
The ML2864 is a new PCM-based sound generator LSI that can play 64 polyphonies simultaneously over eight octaves.
The ML2864 is a new PCM (pulse code modulation)-based sound generator LSI that can play 64 polyphonies simultaneously over eight octaves The ML2864, the third product of the Oki Swing'nRinger sound generator LSI series, provides high-quality sound with the PCM method and supports global standards including GM (General MIDI) System Level 1, which allows easy download of various sound contents
This article was originally published on Electronicstalk on 10 Apr 2002 at 8.00am (UK)
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These chips have received high appraisal from the GSM market thanks to their high sound quality and their compliance to GM and SMF (Standard MIDI File) industry standards", said Hiro Matsubara, General Manager of the Speech LSI Business Unit at Oki Electric.
"The newly added ML2864 further enhances the sound quality, raising the competitive advantages of our sound generator LSIs.
A number of mobile phone vendors have already expressed interest in adopting the chip - as it meets their exact requirements".
The demand for feature-packed mobile phones is increasing, especially in China, the world's largest GSM mobile phone market.
One of the fastest-growing requirements demanded by users is a high quality musical ring tone, and this is made possible through provision of a large number of polyphonies by PCM-based sound generator chips.
To meet the challenge, Oki developed the ML2864 in collaboration with Casio Computer Co.
The new chip, ML2864, doubles the number of polyphonies, from 32 to 64, which gives musical ring tones of mobile phones much higher and deeper sound quality.
The product implements a wave-table ROM and supports GM and SMF standards.
By inheriting major features of the existing sound generator LSIs, the new chip is compatible with the existing chips, so music contents can be shared between them.
Analogue characteristics, including signal/noise ratio and power supply rejection ratio, have also been improved.
Alongside the enhanced functionality and quality, Oki has also managed to reduce the footprint of the device to a world best of its kind, at 5 x 5mm, achieved using unique W-CSP packaging technology.
The company intends to introduce the chip to China, Europe, the USA, Korea and Japan, especially focusing on the GSM and CDMA mobile phone markets.
Volume shipping of the new chip is scheduled to start March 2004.
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