Product category:
Analogue and Mixed Signal ICs
News Release from: Oki Electric | Subject: ML8950
Edited by the Electronicstalk Editorial
Team on 19 August 2004
Triaxial accelerometer takes convertor
onboard
Oki reckons it has developed the world's thinnest three-axis accelerometer module, the ML8950.
Oki reckons it has developed the world's thinnest three-axis accelerometer module, the ML8950 Integrating the sensor chip with the control IC has enabled Oki to develop the world's thinnest package
This article was originally published on Electronicstalk on 10 Apr 2002 at 8.00am (UK)
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In addition to detecting the triaxial (x, y and z) acceleration (+/-3g), the three-axis accelerometer module can also detect inclination and impact shock as well as measure the degree of inclination and vibration.
Targeting the mobile phone, mobile equipment, HDD and entertainment markets, sample shipments will begin in Japan and North America in October 2004 and volume shipments in April 2005.
"Because Oki's module is thin and its shock survivability is high, the tri-axis accelerometer modules can now be mounted onto mobile equipments".
"We believe our world's thinnest module will make a strong impact on mobile handset and mobile equipment manufactures", said Hironori Kitabayashi, President of Silicon Manufacturing Company at Oki Electric.
Oki's ML8950 three-axis accelerometer module, detects triaxial acceleration, inclination and vibration and outputs the signal in a digital format.
With micromachined technology, using SoI (silicon on insulator) wafers, Oki has succeeded in developing a module that combines high shock survivability with a 1.4mm thin film and small size sensor chip, all of which are necessary conditions when mounting onto a mobile equipment.
The control IC chip is equipped with a signal amplification circuit, a control circuit, an analogue-digital convertor and a temperature compensating circuit.
In addition, it is the first three-axis accelerometer module to be equipped with a digital interface.
This removes the need for an ADC on the equipment and simplifies integration of the module into digital equipment because it can be directly connected to the CPU.
This is Oki's first product for the MEMS market, in which it has been providing silicon microfabrication production services since 1999.
Oki has a sales target sales of Y10 billion by the fiscal year ending March 2007 for its MEMS technology and development of high-functionality MEMS sensors by combining LSI design and development technologies with integrated MEMS.
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