Product category:
Microprocessors, Microcontrollers and DSPs
News Release from: Oki Electric | Subject: ML2611
Edited by the Electronicstalk Editorial
Team on 21 December 2006
Audio DAC augments portable sound
quality
Audio LSI combines a stereo-playback-capable DAC, 3D surround functionality and speaker amp in a single chip.
Oki Electric is sampling an audio LSI that combines a stereo-playback-capable DAC, 3D surround functionality and speaker amp in a single chip The ML2611 achieves all this in the world's smallest package size in the 16bit audio DAC with a footprint of 3.0 x 3.2mm
This article was originally published on Electronicstalk on 10 Apr 2002 at 8.00am (UK)
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It is equipped with an authentic acoustic sound that is used in a variety of portable equipment.
Shipments of mass-production quantities of the new IC will begin in June of 2007.
Portable equipment such as mobile phones, portable navigation devices and electronic dictionaries are now being equipped with music playback and TV functions.
However, it is very difficult to play back low-frequency sounds authentically in portable equipment because of the limited space.
Recognising this situation, Oki developed the ML2611 audio DAC specifically to improve sound quality in portable equipment.
The new LSI incorporates all the functionality demanded of an audio DAC LSI, such as a stereo DAC, a stereo speaker amp, a stereo headphone amp and SRS WOW audio enhancement technology - as used in a variety of MP3 players.
"Previously this level of acoustic technology was implemented using DSP or a CPU.
However, with the ML2611, Oki has achieved to incorporate SRS WOW, known as the authentic audio enhancement technology, in to a single chip while maintaining low-power consumption".
"We were able to do this with System C technology, in which Oki has advanced skills", said Masahiko Morioka, President of Silicon Solutions Company at Oki Electric Industry.
"We believe our new LSI will enable engineers to easily add low power consumption accurate acoustic sound without developing additional software".
He further explains: "By adopting OKI's ultra-small W-CSP packaging technology, we were able to achieve the world's smallest package size of 3.0 x 3.2mm for an audio DAC LSI with built in SRS WOW and stereo speaker amp".
OKI plans to expand its sound LSI product lineup further and to develop and market new LSIs that provide rich sound playback in a variety of situations.
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