Product category:
Optoelectronic Sensors, Switches and Receivers
News Release from: Oki Electric
Edited by the Electronicstalk Editorial
Team on 25 January 2007
Chip-size package to shrink CMOS and CCD
sensors
The ZyCSP is a chip size package for image sensors with buried interconnect technology developed by ZyCube.
Oki Electric and ZyCube are to co-operate in commercialising an image sensor LSI with buried interconnects (also called TSV - through silicon via) that is equivalent in size to a wafer-level chip size package (CSP) Compared with current CMOS and CCD sensor packages, the ZyCSP achieves thinner, smaller, lighter and highly reliable characteristics
This article was originally published on Electronicstalk on 10 Apr 2002 at 8.00am (UK)
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The ZyCSP is a chip size package for image sensors with buried interconnect technology developed by ZyCube.
Plating and/or burying a hole through the sensor LSI wafer and applying wiring technology, the new technology without wire bonding gives the ZyCSP an extremely high density.
Its low profile, which is less than 0.6mm, makes it the world's thinnest CSP.
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"Consumers desire information devices to be smaller, higher density with multiple functions as seen in camera-equipped mobile phones and digital cameras", said Manabu Bonkohara, CEO of ZyCube.
"Our strategy is to focus on the image sensor market for these devices for now, and eventually expand to the 3D compound product market with digital signal processing function".
"With our ZyCSP technology, we are determined not only to take 15% share of the world's CMOS, CCD sensor market, but also standardise packaging technologies in the world".
Oki, on the other hand holds advanced wafer level CSP (W-CSP) technology achieving packages equivalent to chip sizes.
Through the collaboration, Oki will work to achieve smaller and thinner passive and active components taking advantage of its W-CSP and semiconductor processing technologies.
It will also be possible for Oki to apply the new production technology for making LSIs having buried interconnections to its own products.
The two companies will jointly develop and manufacture packages for CMOS and CCD sensors with buried interconnects.
Oki will build a combination 8/12in development and production line for ZyCSP at its Hachioji facility in Japan.
"In addition to our current 6 and 8in W-CSP assembly foundry business, we will actively provide small and high-performance packaging solutions by expanding in to 12in with ZyCube", said Takaki Yamada, President of Silicon Micro Device Company at Oki Electric Industry.
"We will deploy business in the growing information device market with ZyCSP products, and remain committed to creating new applications in the 'personal and mobile' markets, and provide smaller, higher performance and lower power consumption products for mobile terminals".
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