Product category:
Electromechanical Components
News Release from: Omron Electronics | Subject: ECIF
Edited by the Electronicstalk Editorial
Team on 09 August 2001
Relays, switches and connectors on show
at ECIF
Omron will attend the ECIF 2001 exhibition in London with its UK distributors Quality Components and Diamond Electronics.
Omron will attend the ECIF 2001 exhibition in London with its UK distributors Quality Components and Diamond Electronics The components and systems specialist will highlight newly announced compact high-current high-temperature relays, subminiature sealed switches and high quality connectors for flexible printed circuit (FPC) applications
This article was originally published on Electronicstalk on 22 Jan 2003 at 8.00am (UK)
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Visitors to ECIF will discover these new Omron solutions at stand numbers E134 and E145.
Omron has recently introduced next generation relay construction that enables very high performance while simultaneously reducing package dimensions.
The new G8P relay family allows applications requiring up to 30A switching capability to be satisfied using a compact, low-cost relay.
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These include HVAC products such as air conditioners, and boiler controls or appliances requiring fan, light and heater controls.
The G5Q family packs 10A-switching capability into extremely small package dimensions of 15.8 x 20.3 x 10.3mm to serve a wide range of switching and control applications.
Advanced construction has enabled these new generation products to achieve high isolation and coil insulation up to UL Class F for applications up to 105C ambient temperature.
Highly efficient mechanical movements, coil design and low contact resistance maximise efficiency and allow designers to specify less bulky, less costly PSUs.
The D2HW series of ultra-miniature precision switches is believed to be the smallest snap-action switch in the industry.
Available contact configurations include SPST, SPDT-NC and SPDT-NO.
Case dimensions are 22% smaller than conventional models, and the switches are sealed, enabling use in automotive applications and household appliances.
Height is 6.5mm, with a footprint of 13.3 x 5.3mm.
Resistance to water and dust ingress is certified to IP67 in the lead wire models and IP50 in terminal models.
Mounting options include PCB mounting with either straight or angled terminals, SM terminals or lead wires.
Off-board alternatives include thermal caulking, press-fit with a number of post mount selections or M3 screw mounting.
The D2HW range also features a number of actuator options, with or without levers, to suit all applications.
The switches are rated up to 2A at 12V DC, with gold alloy contacts for high electrical and mechanical durability in excess of 100,000 and 1,000,000 operations, respectively.
The XF2L series of FPC connectors will also be displayed.
These were introduced in January 2001, and occupy just 18.9 x 3.5mm for 30 pins to create the most space efficient FPC interconnect solution currently available.
Advanced construction enables a low connector profile of 1.2mm without requiring drilling or gouging of the board, and allowing the space beneath the connector to be used to route tracks if required.
Advanced slider design restricts play in the vertical plane, and minimises play when opening and closing the connector.
Insertion life is 20 repetitions, and the connector mechanism is designed to produce an audible click to indicate satisfactory engagement.
The XF2L series is available in upper or lower contact types with 4 to 30 poles, rated to 0.5A at 50V DC, and operate over the extended -30 to +85C temperature range.
Solderable hold-downs further enhance retention without requiring drilling of the PCB.
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