Product category:
Optoelectronic Sensors, Switches and Receivers
News Release from: OmniVision | Subject: OV3630DZL
Edited by the Electronicstalk Editorial
Team on 16 February 2006
Stacked die camera chip upgrades to
3Mpixel
Launched at the 3GSM World Congress in Barcelona, the OV3630DZL stacked die CameraChip device drops in to upgrade cameraphones to 3Mpixel resolution.
This week at the 3GSM World Congress in Barcelona, OmniVision Technologies introduced the OV3630DZL stacked die CameraChip solution With a module size of 9 x 9 x 7mm, the OV3630DZL allows handset customers to upgrade their camera phones from 2Mpixel (OV2630DZL) to 3Mpixel without mechanical design changes
This article was originally published on Electronicstalk on 21 Feb 2005 at 8.00am (UK)
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OmniVision Technologies has released its first CameraChip based on the Standard Mobile Imaging Architecture introduced by Nokia and STMicroelectronics in January 2004.
CMOS image sensor breaks into camera market
According to OmniVision Technologies, the OV5610 5Mpixel camera chip has already achieved eight design wins in digital still camera and video camera markets.
This "drop-in" replacement method will significantly reduce time to market, which is critical in today's highly competitive mobile phone market.
The OV3630DZL is a stacked die camera module design with a 1/3.2in optical format and a module size of 9 x 9 x 7mm, designed specifically for slim handset designs that require very low power consumption.
The module solution features the OV3630, a 3Mpixel CMOS image sensor stacked on top of the advanced OV620 camera bridge processor.
The camera bridge processor produces YUV output in various fully processed and encoded data formats, compatible with all common compression standards.
The OV3630 sensor operates at 15 frames per second at full resolution, enabling the use of an electronic shutter instead of the traditional mechanical shutter.
This reduces the mechanical envelope needed, allowing faster adoption of 3Mpixel camera phones into the mainstream market.
Early adopters of OmniVision's OV3630DZL can gain a competitive edge in their quest for thinner and sleeker phones.
The OV3630DZL camera offers stunning resolution, light sensitivity, superior dynamic range and power efficiency in a small, feature-rich design.
This is largely due to the integrated OmniQSP image processing block, which provides high-grade picture processing and has features that are traditionally only found in digital still cameras.
The OV3630DZL operates on just 2.8V and features many advanced functions such as image effects, edge enhancement, pixel correction, lens shading and other corrective technologies.
The proprietary new sensor technology utilises advanced algorithms to cancel fixed pattern noise, eliminate smearing and drastically reduce blooming.
The OV3630DZL stacked die module was developed in close co-operation with OmniVision's module partners, and samples are currently available.
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