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Product category: Heatsinks and Thermal Management
News Release from: Waytronx
Edited by the Electronicstalk Editorial Team on 04 July 2007

Novel cooling technology wins patent
recognition

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A United States Letters Patent from the US Patent and Trademark Office covers proprietary WayCool thermal management technology.

OnScreen Technologies has received a full grant of United States Letters Patent from the US Patent and Trademark Office covering the company's proprietary WayCool thermal management technology The technology represents a major breakthrough in thermal management capabilities that increases performance and reliability while reducing energy use in high-end electronic components

The Letters Patent, from an application entitled "Cooling systems incorporating heat transfer meshes", represents full patent coverage and associated protections of OnScreen's WayCool-related intellectual property, providing for the use of meshes for cooling in a broad spectrum of applications.

Novel design elements, including the use of meshes, and resulting functionality underlying the novel WayCool thermal cooling capabilities, have been proven to enable the efficient transfer of heat at extraordinarily high rates, thus promoting superior thermal management in high end electronic components.

William Clough, EVP of OnScreen Corporate Development, explains: "The issuance of this patent is a significant milestone in advancing our openly licensable thermal management IP company".

"OnScreen is designing the heat control technology that will lie at the heart of most advanced digital products".

Clough continues: "We are working closely to apply this technology in strategic applications with customers and partners such as OCZ Technology Group and ThermalTake Technology, while engaging in new collaborative licensing and royalty opportunities with companies seeking viable thermal cooling solutions across a variety of markets".

Company CTO, Dr Michael Schuette, comments: "The issuance of this patent by the USPTO protects key elements of this breakthrough technology".

"We fully expect mesh-based heat transfer units to revolutionise the cooling process in electronics because of their higher efficiency and lower total cost of ownership compared with other cooling solutions currently available".

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