RFID chip meets latest EPCglobal standard

Omron Corp will shortly ship an IC tag inlay compliant with Class 1 Generation 2 (C1G2) of EPCglobal specifications.

Omron Corp will shortly ship an IC tag inlay compliant with Class 1 Generation 2 (C1G2) of EPCglobal specifications.

Sample shipments, the first from any Japanese manufacturer, will start in October to suppliers of major retailers, label convertors and others.

Mass production is scheduled to begin in February 2006.

The sample shipped IC tag inlay conforms to the 902-928MHz UHF band used in the USA, and is also compliant with EPCglobal Class1 Generation 2 (C1G2), as defined by EPCglobal, the international standardisation organisation.

The IC tag inlay will be produced by applying a proprietary ultrasonic bonding technology.

This Omron technology uses ultrasonic waves to mount IC chip to the module substrate with less time and can strongly join the module to the antenna by metal welding.

As a result, it realises a high quality IC tag inlay mass production and can provide tags to customers at lower prices.

Omron will continue to manufacture the current Class1 IC tag inlays (96bit) for users until the new C1G2 becomes more widely adopted in the marketplace.

The reader writer will be also designed for US UHF band and it can support the EPCglobal standard protocols of Class0 and Class1.

The reader writer which handles the newest EPCglobal C1G2 will be introduced to the market along with the C1G2 IC tag inlays.

Reader writers installed in the field can be upgraded to the C1G2 by changing their firmware.

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