Product category:
IC and Hybrid Processing Equipment
News Release from: Oxford Instruments Plasma Technology
Edited by the Electronicstalk Editorial
Team on 13 September 2007
Collaboration targets nano-imprint
lithography
Nano-imprint lithography is a versatile, cost-effective, flexible and high-throughput method for fabrication of down to and below 10nm structures.
Oxford Instruments and NIL Technology have collaborated to develop etch processes targeted at nano-imprint lithography Nano-imprint lithography is a versatile, cost-effective, flexible and high-throughput method for fabrication of down to and below 10nm structures
This article was originally published on Electronicstalk on 13 Nov 2006 at 8.00am (UK)
Related stories
Arsenic source speeds MBE growth
The new ECellAs valved arsenic effusion source or "cracker cell" for molecular beam epitaxy is designed for high performance MBE growth of arsenic-containing III-V materials.
Delivery module enhances deposition tools
Oxford Instruments has developed a new TEOS delivery module for plasma-enhanced chemical vapour deposition of silicon dioxide in its PlasmalabSystem100 and PlasmalabSystem133 deposition tools.
This technology suits applications in data storage, optics and bio-sensors.
The collaboration combined Oxford Instruments' process development expertise in plasma etching with NIL Technology's experience in developing and supplying templates, stamps and processes for nano-imprint lithography.
Together the companies have developed processes for the etching of nano-imprinting stamps in fused silica, de-scumming of the imprinted polymer with negligible critical dimension (CD) loss, and etching of the final structure.
The etch developments were carried out using Oxford Instruments' PlasmalabSystem100 inductively coupled plasma (ICP) tool.
ICP etch shows superior capabilities for etching of high-performance NIL stamps with well-controlled profiles.
The stable low-pressure de-scum process possible effectively removes residual polymer after imprinting with minimal loss of CD.
ICP is also perfect for transferring the imprinted pattern into fused silica and silicon.
Brian Bilenberg, Chief Technical Officer of NIL Technology said, "We saw an opportunity for NIL Technology and Oxford Instruments to work together to develop processes which are optimised as an overall end-to-end process rather than in individual steps".
"As we continue further work, we expect to improve the whole process of etching nanostructures created by nano-imprint lithography yet more".
The current results of the project are being presented at PESM2007 (plasma etch and strip in micro-electronics) held at IMEC, Leuven, Belgium and MNE2007 (micro and nano engineering) in Copenhagen, Denmark.
• Oxford Instruments Plasma Technology: contact details and other news
• Email this article to a colleague
• Register for the free Electronicstalk email newsletter
• Electronicstalk Home Page
Search the Pro-Talk network of sites
