Dry etching system offers several tools in one

The PlasmalabuEtchEL provides the clean removal of polyimide, nitrides and oxides to reveal the underlying device structure for the desired analysis.

Oxford Instruments has added the the PlasmalabuEtchEL dry etch tool to its failure analysis product line.

The PlasmalabuEtchEL is a flexible and economic entry-level tool which still offers the switchable dual-mode PE/RIE (plasma etch/reactive ion etch) capability found on the company's PlasmalabuEtch200 and PlasmalabuEtch300 systems.

The dual-mode PE/RIE configuration enables processes to be run for isotropic polyimide removal (RIE), isotropic SiNx removal (PE) and anisotropic IMD/ILD etch (RIE) in a single tool, for small die or packaged devices through to 200mm wafers.

The PlasmalabuEtchEL offers outstanding uniformity with excellent reproducibility and selectivity, promising clean removal of polyimide, nitrides and oxides to reveal the underlying device structure for the desired analysis.

Oxford Instruments offers a family of dry etch de-processing solutions for failure analysis using PE, RIE and ICP (inductively coupled plasma) technologies.

These flexible tools allow a range of processes from passivation removal to anisotropic oxide removal, from small die or packaged chip through to 300mm wafer, in a compact footprint with convenient open-loading of samples.

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