Product category:
PCB Assembly Equipment and Tools
News Release from: Palomar Technologies | Subject: Model 8000
Edited by the Electronicstalk Editorial
Team on 13 July 2007
Ball bonder emulates wedges
Wedge emulation technology makes a ball bonder a viable and flexible alternative to a wedge bonder.
Palomar Technologies has developed novel wedge emulation technology for low-profile interconnects, fine-pitch running-stitch interconnects, and die-to-die bonding in high-density packages such as LEDs and RF devices Wedge emulation uses Palomar Technologies' Model 8000 ball bonder to maximise the bonding speed, reliability, and reduced keep-out space of a ball bonder for high density packages that previously required a wedge bonder
This article was originally published on Electronicstalk on 8 Jan 2007 at 8.00am (UK)
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Using a specially developed chain bonding stitch-stitch interconnect, this technique bonds seven to 12 wires per second instead of the one or two wires per second you get with a wedge bonder.
Software allows the user to program an interconnect beginning with a stitch instead of ball, as in wedge bonding, and complies with the visual standards defined per MIL-STD-883, Method 2017.
As there is no ball, the user can use a wire other than gold, such as aluminium or copper, for the interconnect.
This truly makes the ball bonder a viable and flexible alternative to a wedge bonder.
"There is little debate that ball bonding is faster and more robust", says Don Beck, Applications Engineering Manager for Palomar Technologies.
"However, due to a need for low profile interconnects or fine pitch, wedge has continued to dominate key market segments".
"Wedge bonding is also typically used when a design requires a running stitch interconnect or die to die bonding".
"With Palomar's new wedge emulation technology, these processes can now be achieved on Palomar's Model 8000 ball bonder".
"With the high cost of capital equipment, the need to conserve manufacturing floor space, reduced personnel, efforts to streamline operations, and increased time to market pressures, being able to perform almost all bonding operations on a ball bonder is an advantage".
"By adding chain bonding to a ball bonder, manufacturers can support applications that require higher frequencies and denser packages without sacrificing throughput and yield".
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