Dummies provide realistic thermal testing

Edited by the Electronicstalk editorial team Jul 29, 2002

Mechanical SMT samples can now be ordered assembled with "dummy" silicon chips inside and used successfully and economically for thermal testing applications.

Mechanical SMT samples can now be ordered assembled with "dummy" silicon chips inside and used successfully and economically for thermal testing applications.

These chips have no circuitry or metallisation (for wire bonding) and are not electrically connected inside the package to the leadframe or substrate making them the ideal subject for cost-effective testing.

The dummy die simulates the CTE (coefficient of thermal expansion) of a live part without the expense of a functional part.

All other physical materials and associated assembly processes used are the same for "dummy" SMT packages as for live packages at a substantial cost savings.