CSP test die covers all the standards

Edited by the Electronicstalk editorial team Sep 19, 2002

Amkor has adopted the Ultra CSP as its standard wafer level package offering, available now from Practical Components.

Amkor has adopted the Ultra CSP as its standard wafer level package offering.

Ultra CSP is a true wafer-level chip-scale package that incorporates a thin film redistribution process to route the pads to JEDEC/EIAJ standard pitches.

Conventional CSP solder bumps are formed on the rerouted pads.

Ultra CSP is designed to use industry-standard surface-mount assembly and reflow techniques.

By using conventional SMT placement equipment and avoiding the need for underfill, the end-user experiences many of the cost benefits associated with other JEDEC standard area array packages.

Amkor's Ultra CSP is ideal for portable communications and related applications that require a low cost packaging solution with small form factor.

Features include: incorporates standard JEDEC/EIAJ pitches and CSP solder ball diameters, compatible with conventional SMT assembly and test techniques, uses cost-effective thin film redistribution technologies, back-side laser mark compatible, eutectic and Pb-free solder balls and no need for underfill in many applications.

The die sizes currently available are 7mm square 0.5mm pitch with 98 I/O or 7mm square 0.4mm pitch with 192 I/O.