Dummies check out chip-scale packages

Mechanical samples of the new Amkor etCSP are now available.

Mechanical samples of the new Amkor etCSP are now available.

This package is the first ball grid array capable of extremely thin 0.5mm maximum mounted height.

This thin package can squeeze into applications when a thin form factor is required because vertical height is limited.

Body size is 12 x 12mm with 176 I/O 0.5mm pitch or 7 x 7mm with 80 I/O 0.5mm pitch.

The resulting package consists of two peripheral rows of 0.3mm diameter solder balls to allow common SMT processing.

Another benefit of this package design is superior moisture resistance.

It is also available in lead-free formulations.

Dummy components are exact mechanical equivalents of live components used when only the physical properties of the components are required.

These components can cost as much as 80% less than live components making the ideal for testing of solder processes, machine setup and other process evaluations.

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