Board checks out latest packages

The PCB007 MicroLeadFrame (MLF) test board is really two test boards in one.

The PCB007 MicroLeadFrame (MLF) test board is really two test boards in one.

The top side of the board consists of daisychained MLF pads; the bottom side provides a variety of SMD component types.

Amkor's new MLF packages are a near CSP plastic encapsulated package with a copper leadframe substrate.

MLF packages have perimeter pads on the bottom of the package.

Thermal enhancement is provided by Amkor's ExposedPad technology.

The test board front side has land patterns for MLF package sizes of 2 x 3 to 10 x 10mm in varying I/O counts.

Lead pitches of these include 0.5, 0.65 and 0.8mm.

The MLF side of the PCB007 board is designed to help customers become more familiar with the placement and process characteristics of MLF packages.

The wide assortment of pad sizes and pitches provide a comprehensive overview of MLF packages.

Daisychain patterns on the PCB007 board complement the patterns on the components allowing continuity to be tested.

The bottom side of the PCB007 test board provides a variety of SMD component types.

The bottom of the board has LQFP components with 0.4 and 0.3mm pitch, pads for the PBGA256 component with a 1.00mm pitch and two TSOP Type II components - the TSOP54 with a 0.8mm pitch and the TSOP86 with a 0.5mm pitch.

Standard board finish for the PCB007 is alpha level silver flash.

Other finishes are available on request.

Standard board thickness is 0.062in.

Customers always have the option of mixing and matching components to suit their requirements.

Gerber and x, y, theta data and digitised files provided by Aegis Software are included at no charge.

Large quantities as well as single pack kits are available.

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