Product category:
Electronics Manufacturing Quality Assurance
News Release from: Practical Components | Subject: Dummy silicon grade wafers
Edited by the Electronicstalk Editorial
Team on 04 November 2003
Dummy component range takes in wafers
Practical Components now supplies dummy silicon grade wafers in various sizes.
Practical Components now supplies dummy silicon grade wafers in various sizes Wafers are also available to provide individual test die that can be packaged on tape and reel, waffle pack trays or sawn and left on an aluminium seal ring
Also available are daisychained "unbumped" test wafers.
These wafers are used for pick and place purposes, underfill, dicing (saw) practice and vision recognition as well as other specialized uses.
Wafers are available 100, 125, 150, 200 or 300mm diameter.
Typical wafer thickness range from 625 to 800um.
Packaging includes wafer cut and left on metal (aluminium) seal ring FF105 or FF108, cassette (coin roll), wafer jar (with antistatic foam disk inserts) or tape and reel.
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