Product category:
Electronics Manufacturing Quality Assurance
News Release from: Practical Components | Subject: BGA Reballing Kit
Edited by the Electronicstalk Editorial
Team on 02 June 2004
Budget route to repair BGA packages
The Practical Components BGA Reballing Kit features patented stencils and holders are used to manually rework BGA components to original condition.
The Practical Components BGA Reballing Kit features patented stencils and holders are used to manually rework BGA components to original condition The kit allows users to restore costly BGAs to original condition using hot-air rework stations or tools
This article was originally published on Electronicstalk on 16 Jul 2002 at 8.00am (UK)
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Test board checks out fine-pitch placement
The 0201 test board is the newest addition to the Practical Components range of fine-pitch multi-application solder training boards and kits.
The user simply squeegees on flux, pours on solder balls and reworks with hot air.
Stencils and holders are available separately, so users can purchase only the stencils and stencil holders they need.
All the standard stencils and holders are available as a kit for one of the easiest and least expensive BGA repair solutions.
This handy kit includes: a flux pen; a vial of 50,000 solder balls; a choice of 20, 25 or 30mil solder spheres; a choice of Sn63/Pb37 or Sn10/Pb90 solder alloy; one standard holder (component specific); and one standard stencil (component specific).
Holders and stencils are available for most BGA packages from 12 x 12 to 42.5 x 42.5mm.
The stencils and holders available individually and all standard stencils and holders are also available as a complete kit.
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