New scheme checks out lead-free processes

A new lead-free process capability programme combines lead-free components and test boards with analytical evaluation and process capability validation services to IPC and J-STD requirements.

A new lead-free process capability programme combines lead-free components and test boards from Practical Components with Cookson Electronics' analytical evaluation and process capability validation services to IPC and J-STD requirements.

The CE Analytics/Practical Components test kit consists of: PCB test boards with Polyclad FR-370HR laminate, various lead-free compatible pad finishes (Entek Plus CU-106A, Entek Plus CU-106A-HT and Alpha-Level immersion silver), industry standard lead-free dummy components (BGA, MLF, QFP, LQFP, SOIC, TSOP, SOT and passives), Alpha OM-338 lead-free solder paste and Alpha Telecore + cored wire, and process application guidelines.

This combined package smoothes the transition to lead-free by offering a complete solution.

The CE Analytics/Practical Components programme is unique in that it not only offers the materials and analysis but also validation of the lead-free process before entering production.

CE Analytics laboratory services include: Lead-Free Process Capability Validation by Macro and microscopic inspection and analysis of processed assemblies compared with IPC and J-STD requirements; a validation report with recommendations for process optimisation if applicable; the CE Analytics lead-free process capability validation certificate; voiding analysis; macroscopic examination of processed assemblies (nondestructive); and microscopic examination of solder connection integrity.

Practical lead-free dummy components are exact mechanical equivalents of live components used only when the physical properties of the components are required.

These components can cost as much as 80% less than live components, making the ideal for testing of solder processes, machine setup and other process evaluations.

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