PoP dummy component introduced at Productronica

Edited by the Electronicstalk editorial team Nov 14, 2005

Practical Components is to introduce the new Amkor Technology PSvfBGA (PoP) to its extensive line of dummy components at the 2005 Productronica Exibition in Munich, Germany, Hall A4 Stand 480.

Package on Package (PoP) is designed for products requiring efficient memory architectures including multiple buses, increased memory density and performance, while reducing mounted area.

Portable electronic products such as mobile phones, digital cameras, PDAs, portable players, gaming and other mobile applications can benefit from the combination of stacked package and small footprint offered by Amkor's PSvfBGA.

As a result, PoP is experiencing rapid and widespread industry adoption with strong support.

10-15mm body sizes planned; top package I/O interface 0.65mm pitch accommodating 104 to 160 pin counts; high I/O 0.50mm pitch interface in development; fine pitch 0.50mm bottom package footprints with roadmap to 0.40mm pitch; established package on package infrastructure (4 plus years of development with leading OEM, EMS and equipment providers); wafer thinning/handling less than 100um; consistent product performance and reliability; package configurations compliant with JEDEC standards in development; package pre-stacking support and services available based on demand; bottom PS-etCSP/PSvfBGA and top FBGA/Stacked CSP packages are qualified and available for high volume production; stacked package heights of 1.2 to 1.6mm available in a variety of configurations.

Amkor Technology is an independent provider of semiconductor packaging with an extensive offering of advanced products like the PSvfBGA (PoP), ChipArray, FlexBGA, MicroLeadFrame (MLF) and SuperBGA.

Practical Components is the exclusive distributor of mechanical samples of these as well other sought after Amkor Technology packages worldwide.

Practical dummy components are used in assembly process evaluation, calibration, qualification, training and other situations where only the mechanical characteristics not the functioning components are required.

Practical lead-free dummy components are exact mechanical equivalents of live components used only when the physical properties of the components are required.

These components can cost as much as 80% less than live components, making the ideal for testing of solder processes, machine setup and other process evaluations.