Dummy component lines brought up to date

Free catalogue is organised by package type and category with each product accompanied by drawings, description, part number with special attention to lead-free availability and formulations.

Dummy component specialist Practical Components has published its latest catalogue designed to help engineers quickly find the key products needed to qualify their technology, train and grow their business.

According to Practical President Kevin Laphen: "Practical is committed to ensuring that electronic assembly engineers and technicians have information about new and innovative technology and also makes available cost effective components, PCBs and training kits to improve their process".

The free catalogue is organised by package type and category with each product accompanied by drawings, description, part number with special attention to lead-free availability and formulations.

Included in this year's catalogue are offerings in SAC105, SAC125Ni, SAC305, SAC405, SnPb as well as Sn3.5Ag.

With the help of strategic partners Amkor Technology, Aegis Industrial Software, Cookson Electronics, Indium, FlipChip International and Aim, Practical continues to lead in technology and creative production and development tools.

The following are a few of the additions to the latest catalogue.

Practical Components and Aegis Industrial Software have partnered together to offer a traceability and control kit designed to validate an entire manufacturing process and provide the potential for rich product and process traceability detail.

The PC009-40 Traceability and Control Validation Kit benefits from Aegis' methods of rating traceability which have been concurrently developed with, and adopted by, many of the leading manufacturers in the industry.

The popular PoP package from Amkor Technology is available in a new body sise as well as revised test boards.

Sales are projected to double in 2007 and nearly double again in 2008, with continued robust growth through 2010.

Amkor Technology LGA land grid array packages are now available without solder balls, including CABGA, CTBGA and CVBGA types.

The same standard daisychained substrate will be used based on open tooling.

And new Amkor tsCSP thin substrate chip scale package land grid array multirow packages (up to three rows of lands) are compatible with established CSP mounting processes in thicknesses to less than 0.4mm.

Supporting the catalogue, the Practical Components website has been updated with more than 1250 pages of dummy components, test boards, training and setup kits, component drawings, engineering/design guide data, daisychain patterns, production tools, training aids and a complete downloadable catalogue.

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