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Partnership programme aids SiP designers

A Polyteda Software Corporation product story
Edited by the Electronicstalk editorial team Jul 18, 2006

Polyteda Software Corporation has set up its Initial Strategic Partnership Programme (ISPP).

Polyteda Software Corporation has set up its Initial Strategic Partnership Programme (ISPP).

The main target of the programme is a creating partnership between semiconductor manufacturers and the company as a system-in-package (SiP) EDA tool vendor for developing effective solution for complex multiphysics problems that SiP designers are facing in their everyday practice.

System-in-package (SiP) is a relatively new manufacturing technology that is still in its developing stage.

There are no industry-wide standards yet.

Vast varieties of technological processes, design flows, and testing procedures exist among semiconductor manufacturers.

It creates a huge problem for EDA vendors: the software tools have to cover all this diversity.

Even in other, more traditional electronic design areas, EDA companies are spending enormous effort to support ranges of similar software products because of differences in design flow.

In case of SiP, the complexity of multiphysics processes is multiplying the varieties of design flow and creates almost unlimited heterogeneity.

The Initial Strategic Partnership Programme (ISPP) is a new approach to solving this fundamental issue.

The main principle of the programme is to create an opportunity for semiconductor manufacturers for incorporation of specific requirements of their own design flow, data formats, and even organisational practices into the company's new product, SiP design suite Skyscraper.

The product is an integrated design environment that allows to simulate all aspects of multi-physics process in the SiP designs - thermo, mechanical, EM, RF, and their combination before going to manufacturing.

It offers full range of package designing tools in one integrated product: schematic capture, 3D package editor, auto placement, auto routing, DRC, and complex multiphysics simulation.

ISPP is a limited time offer.

Currently, the company is developing version 1.x of the product.

It is the most open version for adjustment to specific requirements of a particular design flow.

The product will be closed to changes in September 2006.

Polyteda Software Corporation invites all interested parties for collaboration to create a new generation of real-world EDA tool.

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