Focused infra-red heating for "gentle" rework

A PDR SMT/BGA Rework Solutions product story

Edited by the Electronicstalk editorial team Oct 2, 2002

PDR's IR-X400 focused IR SMT/BGA rework system incorporates patented focused infra-red (FIR) technology that offers a safe, simple and gentle heating method with precision process control.

PDR's IR-X400 focused IR SMT/BGA rework system incorporates patented focused infra-red (FIR) technology that offers a safe, simple and gentle heating method with precision process control.

PDR's patented focused infra-red (FIR) rework system technology has always offered a real alternative to hot air in the choice for equipment to remove and replace those difficult SMT and BGA components.

PDR now introduce the very latest system to incorporate this technology, the IR-X400 focused IR SMT/BGA rework system, to replace the highly successful Lightmaster.

Hands free and semi-automatic, the IR-X400 provides the highest level of profiling and process control necessary for the effective rework of even the most advanced packages, including SMDs, BGAs, uBGAs CSPs and Flipchips.

The IR-X400 combines its focused IR heating system with a dual zone IR PCB preheater, with independent component and PCB closed loop temperature control, ensuring optimum process control at all times without the risk of overheating.

The IR-X400 is equipped with the all-new advanced digital controller, which combined with PDR's unique ThermoActive V3 software, offers full computer control and incorporates user friendly "drag and drop" features providing the operator with the ability to easily create a new thermal profile.

The IR-X400 offers extensive features as standard, including a precision component pick-up, macro-micro z-axis with rotation and a precision x-y table with accurate macro/micro movement.

While optional features include CCTV split-beam prism based alignment system for the accurate replacement of BGA and uBGA components and additional lenses covering any component combination.

"Along with the trend for ever smaller handheld devices, follows the increasing specification of array package components as designers strive to pack ever greater functionality onto the board", said Roger Gibbs, Managing Director of PDR.

"Reworking these miniature components poses a real challenge, at a stage in the production cycle when the PCB's value is at its highest.

We have designed the IR-X400 to simply and safely implement the highest level of process control, real-time and without the complex issues associated with high-end rework systems".