Product category:
PCB Assembly Equipment and Tools
News Release from: PDR SMT/BGA Rework Solutions | Subject: Focused IR
Edited by the Electronicstalk Editorial
Team on 04 May 2007
Focused IR technology excites rework
interest
Focused infra-red rework specialist PDR received much interest from visitors to its stand at this year's SMT exhibition.
Focused infra-red rework specialist PDR received much interest from visitors to its stand at this year's SMT exhibition For most EMS providers and OEMs, the single biggest factor governing profitable implementation of BGA technology is their ability to rework defective BGAs quickly, safely and effectively; yet thanks to increasing PCB complexity, miniaturisation and lead-free processes, rework has never been harder than it is today
This article was originally published on Electronicstalk on 2 Oct 2002 at 8.00am (UK)
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Focused infra-red heating for "gentle" rework
PDR's IR-X400 focused IR SMT/BGA rework system incorporates patented focused infra-red (FIR) technology that offers a safe, simple and gentle heating method with precision process control.
Focused infra-red simplifies lead-free BGA rework
Some of the world's top OEMs and EMS providers rely on focused infra-red technology to simplify one of electronics manufacturing's riskiest, most demanding and unavoidable tasks.
Now, more than ever before, electronics manufacturers need an SMT/BGA rework process they can rely on: that's where focused IR technology comes in.
Pioneered by PDR, this noncontact tool-free technology is specified by many of the world's largest names in electronics manufacturing.
Although active in sectors as varied as defence, aerospace, avionics, telecomms, automotive and computers, these companies have at least one thing in common - they have all discovered the advantages of a rework process that is safer, easier to use and more versatile than hot gas.
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IR handtool focuses on BGA rework
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When using focused IR, only the component to be reworked is reflowed, using gentle, totally controllable IR heat.
It is vital to control both component and PCB temperatures during rework: apply too little heat and the PCB may draw thermal energy away from the component, hampering reflow.
Too much, too fast creates the risk of irreversible and expensive damage.
Focused IR solves these problems by applying exactly the right heat energy, precisely when and where it is needed.
Designed to rework any SMD component that will pass through a reflow oven, focused IR technology is ideal for BGAs, microBGAs, CSP and flip chip devices that are difficult to reflow using soldering irons and hot gas systems, as well as for small components which can be blown off centre by hot gas flows.
There are no nozzles, focus hoods or shields - the lens and iris assembly can focus the heat onto any component, independent of size or shape.
Access, which can be a major problem for hot gas systems on densely-packed boards, is fast and easy.
With total visibility of the component at all times, the operator simply focuses the visible heat spot on the target component, protecting adjacent components from potential damage.
The regular replacement of tool accessories for hot gas rework can cost a typical EMS company hundreds of thousands of dollars, and the right tool selection often requires operator experience.
Focused IR eliminates these costs while simplifying and speeding rework.
Furthermore, as it is a noncontact method, there is no risk of physical damage to components or the PCB itself, so assemblies can be repaired that would otherwise have been scrapped.
This means higher overall yields and throughputs - thus investment in Focused IR technology, rather than costing money, can mean significant savings.
Whether reworking simpler boards and components, or higher pin count fine-pitch devices in a strictly controlled process, it is imperative that equipment purchased for today's needs can be upgraded as requirements change.
PDR's technology has been designed to grow with the businesses that own it; from simple manual equipment to advanced precision systems with leading-edge board and component alignment technology, and digital closed-loop thermal profile control.
During rework, the target component must be exposed to a thermal profile close to that created in the reflow oven to avoid thermal damage.
This is achieved using noncontact thermal sensors that track precise component and board temperatures in real time, and feed these into PDR's powerful yet simple closed-loop automatic process control software.
As focused IR heat is instantaneous and fully controllable, temperatures remain within just 2C of the target profile at all times.
A great believer in keeping things simple, PDR builds ease-of-use into one of the electronics industry's most complex and potentially hazardous processes: the operator simply selects the right profile for the job and presses a button.
Even thermal profiling on new boards is easy with focused IR systems, typically taking minutes rather than the many hours, if not days, required by hot gas systems.
The process is also extremely safe as, following preheat, the component ramps to reflow temperature using passive heat energy from a very gentle 150W IR lamp.
The operator can safely put a hand under the beam, so fragile temperature-sensitive devices such as plastic sockets, SMT connectors and, of course, BGAs can all be reworked safely and effectively.
With all these advantages, and thanks to industry-leading mechanical, optical, electronic and control features, PDR enables EMS providers and OEMs all over the world to achieve easily the highest quality rework in the industry.
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