Product category:
Power Supply ICs and Controllers
News Release from: PolarFab | Subject: BP30
Edited by the Electronicstalk Editorial
Team on 16 April 2003
Latest 30V process is ready to run
PolarFab has achieved qualification for production of its 1.25-micron, 30V junction-isolated modular bipolar and complementary bipolar process for 6in wafers.
PolarFab has achieved qualification for production of its 1.25-micron, 30V junction-isolated modular bipolar and complementary bipolar process for 6in wafers The extensive qualification performed on the BP30 process was based on the JP-001 standard, a foundry process qualification guideline recently released jointly by the JEDEC Solid State Technology Association and the Fabless Semiconductor Association (FSA)
This article was originally published on Electronicstalk on 15 Oct 2002 at 8.00am (UK)
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Smaller die size for 30V process
PolarFab now offers a 1.25-micron, 30V junction-isolated modular bipolar process for 6in wafers.
Kits speed power device design
PolarFab and Silvaco have developed process design kits for PolarFab's BP30 30V complementary bipolar process supporting Silvaco circuit simulation and custom IC CAD tools.
The BP30's feature size of 1.25 microns is much smaller than similar processes with a 4.0-micron geometry, resulting in increased packing density and a reduced die size.
Applications for the BP30 process include power management applications up to 30V such as amplifiers, line drivers and other linear applications.
PolarFab's BP30 process, which employs an innovative lateral isolation technique that provides tight packing density without increasing process complexity, is available in either one- or two-layer metal process options.
The BP30 process features an NPN transistor capable of 3GHz with a 30V BVcer and a 30V BVcbo.
A washed emitter in the NPN transistor increases the performance of the chip by keeping the size of the NPN small, which reduces parasitics.
Other devices include a 30V lateral PNP transistor, a 30V substrate vertical PNP transistor, two implanted resistors, a Schottky diode, a buried zener diode, and high-density capacitors.
An isolated vertical PNP transistor is available as an optional module.
PolarFab provides comprehensive design support for the BP30 process, including a Cadence Process Design Kit (PDK), fully characterised device models - including corner models - ESD protection and complete documentation.
By using statistical processing control (SPC) techniques, PolarFab continuously monitors and improves the BP30 process.
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