Product category:
Analogue and Mixed Signal ICs
News Release from: PolarFab | Subject: ABC3 process
Edited by the Electronicstalk Editorial
Team on 22 July 2003
Mixed-signal process revealed
PolarFab has published a new datasheet describing its 0.8-micron complementary BiCMOS 6in wafer process.
PolarFab has published a new datasheet describing its 0.8-micron complementary BiCMOS 6in wafer process The ABC3 process is designed for a wide range of high speed/high voltage analog and mixed signal applications, and supports chips running in excess of 1.5GHz
This article was originally published on Electronicstalk on 6 Dec 2004 at 8.00am (UK)
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PolarFab has improved its 6in complementary BiCMOS (c-BiCMOS) RFBC/ABC3 processes to provide reduced die sizes and decreased design times.
The datasheet includes specifications and other features of the ABC3 process, including its capability to safely handle power supply ranges up to 10V, due to the ability to double-tub devices.
The process also supports a high-voltage option of 13V (eg -8V/5V) when a few key layer spacings are increased.
The process features devices such as vertical NPNs, vertical PNPs, NMOS/NMOSTub, PMOSTub, 0.8-micron Lpoly CMOS, high-value P-diffused resistors and Schottky diodes.
The datasheet also describes how PolarFab fully supports the new ABC3 process with a complete design tool kit that includes models, a Cadence PDK (process design kit), and a design and layout manual.
The company also offers guidelines for ESD protection and latch-up preventions, as well as design tool kit support and product development consulting services.
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