Mixed signal process runs beyond 1.5GHz

Edited by the Electronicstalk editorial team Sep 16, 2003

PolarFab has published a new datasheet on its RFBC 6in wafer process, a 0.8-micron complementary BiCMOS process that is ideal for high speed/high frequency analogue and mixed-signal applications.

PolarFab has published a new datasheet on its RFBC 6in wafer process, a 0.8-micron complementary BiCMOS process that is ideal for high speed/high frequency analogue and mixed-signal applications.

The RFBC wafer process, which supports chips running in excess of 1.5GHz, handles power supply ranges of up to 10V, and includes a high-voltage option of 13V.

The RFBC process features poly-emitter NPNs, vertical PNPs, 0.8-micron Lpoly CMOS, poly-poly capacitors and two- or three-layer metal options.

An SiChrome enhancement feature is planned to be added to the process in 2004.

The datasheet also lists the extensive design support options offered by PolarFab for the RFBC process.

PolarFab's complete design tool kit includes digital and analogue cell libraries, including ESD protection.