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Product category: Analogue and Mixed Signal ICs
News Release from: PolarFab | Subject: Polar35
Edited by the Electronicstalk Editorial Team on 11 May 2004

Modular CMOS process features flexible
analogue

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PolarFab now offers a 0.35-micron modular process that features 5V CMOS and analogue device bundles.

PolarFab now offers a 0.35-micron modular process that features 5V CMOS and analogue device bundles By providing both CMOS and analogue device bundles with predefined devices, the Polar35 process allows customers to optimise designs for their desired application

Design engineers can now increase yields and reduce costs and die size by using only those modules specific to their application.

The process, manufactured on 8in (200mm) wafers, offers a flexible, cost effective solution for a wide variety of analogue and mixed-signal power management, as well as smart power applications for the computing, consumer, industrial, and communications markets.

Polar35's 5V CMOS devices are based on 0.35-micron design rules that increase gate density, reducing die size compared with typical 0.5-micron CMOS processes.

The CMOS device bundle includes diffused N+ and P+ resistors, an N+ gate poly resistor, and ESD devices.

The 5V analogue bundle, typically used in 3.3V power management applications to handle inductive voltage spikes, expands the device offering with a poly-poly capacitor, a high sheet rho resistor, a lateral PNP, and a Schottky diode.

The Polar35 process is available with up to three layers of metal for additional space savings.

Future process enhancements include the addition of several high performance devices, including a complementary pair of high-performance bipolar transistor devices and higher voltage devices.

Production qualification of the Polar35 process is set for the fourth quarter 2004.

However, designers can immediately take advantage of PolarShuttle, PolarFab's multiproject, fast-track programme, to manufacture prototypes.

The Polar35 process is available with complete design support and documentation, including a Cadence process design kit (PDK), ESD protection, fully characterised device models, and a comprehensive design and layout manual.

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