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Product category: Analogue and Mixed Signal ICs
News Release from: PolarFab | Subject: Polar35 process
Edited by the Electronicstalk Editorial Team on 16 March 2005

Datasheet details complementary BiCMOS
process

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PolarFab has published a new datasheet on its cost-effective, flexible Polar35 process, a 0.35-micron modular complementary BiCMOS process manufactured on 200mm wafers.

PolarFab, the only US-owned, pure-play analogue and mixed-signal semiconductor foundry, has published a new datasheet on its cost-effective, flexible Polar35 process, a 0.35-micron modular complementary BiCMOS (c-BiCMOS) process manufactured on 200mm wafers The datasheet highlights the specifications that make Polar35 ideal for a wide variety of high performance circuitry for consumer, data communications and power management applications, including low-noise and precision amplifiers, supervisory circuits, photodetector integrated circuits (PDIC) and line drivers

The new 2-page datasheet describes Polar35's comprehensive device suites that allow customers to optimise analogue and mixed-signal designs.

Information included details the BiCMOS, CMOS and bipolar device suites that incorporate a low noise NPN bipolar transistor, a pair of complementary bipolar transistors, a full set of passive devices including a 3kohm/square poly resistor and a high density 2.25fF/um2 poly-poly capacitor, space-efficient ESD protection devices, and integrated silicon photodiodes with patent pending anti-reflective coating for 405, 650 and 780nm wavelengths.

A representative cross-section of Polar35's integrated devices is included in the new datasheet.

Also listed are the extensive design support options offered by PolarFab for its Polar35 process, which include 5V digital cell libraries supporting schematic-based or SPR flows, a Cadence Process Design Kit (PDK), scalable models and P-cells, a comprehensive design layout manual, and models (Spectre, PSpice and HSpice).

Additionally, Polar35's key rule values, as well as compatible mask layer and metal layer options available, are presented in the datasheet.

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