Product category:
Communications ICs (Wireless)
News Release from: NXP Semiconductors | Subject: TEA5767 and the TEA5768
Edited by the Electronicstalk Editorial
Team on 13 February 2002
IC reinvents radio receiver architecture
Philips Semiconductors is claiming a breakthrough with the launch of a family of fully integrated single-chip stereo radios for low-voltage and low-power applications.
Philips Semiconductors is claiming a breakthrough with the launch of a family of fully integrated single-chip stereo radios for low voltage and low power applications Making significant cuts in the number of external components and the cost of the peripherals, the radio is completely adjustment free and can tune into European, US and Japanese FM bands
This article was originally published on Electronicstalk on 23 Oct 2001 at 8.00am (UK)
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With the growing demand to integrate radios into mobile phones, this new development will transcend current industry capabilities, allowing radios to feature in a variety of portable devices where there is little space available.
The first chips to be released will be the TEA5767 and the TEA5768.
"Philips Semiconductors has realised a breakthrough in radio architecture design in such a way that expensive external parts have been replaced by smart silicon.
This has resulted in lower material costs and a smaller footprint for the total radio function, giving simpler radio design.
The latter translates into faster time to market for our customers", commented Kees Joosse, market sector team manager at Philips Semiconductors.
"Capitalising on the trend for access to radio at any time, in any place, this new family of chips will enable the inclusion of radios in a whole new set of products.
'One-chip radio' is now becoming a reality, which will enable many new, exciting innovations".
Classical radio architecture requires external parts to be aligned during production.
Many of these external parts handle high frequency signals, which need very carefully designed PCBs.
The TEA5767 and TEA5768 chips have much fewer external parts than standard chips.
They need no alignments and PCB design is much less complicated because of the small footprint of the total radio function when using the new chip.
Samples of TEA5767 and TEA5768 are currently available.
Volume production will begin in the first quarter of 2002.
(This was Electronicstalk's Top Story on 12 February 2002).
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