Development kit gets 3G basestations started

The Infrastructure Development Kit (IDK) is a new validation and prototyping tool designed to develop and improve embedded 3G cellular infrastructure technology for basestation manufacturers.

Philips Semiconductors has launched its new Infrastructure Development Kit (IDK) a completely new validation and prototyping tool designed to develop and improve embedded 3G cellular infrastructure technology for basestation manufacturers.

The newly customised solution forms the backbone of Philips Semiconductors 3G cellular infrastructure products, offering the market increased integration at significantly reduced cost.

The component count in the IDK ensures faster time-to-market through simplification of the manufacturing process, while increasing the opportunity for 'right first time' development through pre-silicon testing.

The solution also enables complete SoC level integration.

"We are in the unique position of being able to offer our customers complete embedded customised SoC solutions", said Michel Le Lan, business development manager for cellular infrastructure at Philips Semiconductors.

"The IDK is a cost-effective, highly integrated solution that speeds up total development time.

Depending on the level of integration required by the customer, we are able to offer up to a 50% reduction with our integrated solution.

Our products are helping to reduce the cost of 3G infrastructure, which will in turn help kick-start the 3G handset market".

The flexibility of the IDK enables close developmental work between Philips Semiconductors and its customers through the ability to integrate any type of IP (intellectual property).

The network of re-useable IP enables the simultaneous development of software and hardware, helping designers to start working on prototyping and coding the application on a 'virtual' ASIC.

Using FPGA technology, specific IP can be prototyped and simulated on hardware prototyping platforms.

The total cellular solution is based on multicore integration and includes the Infrastructure DSP Core Subsystem (IDCS), providing the necessary database and test chip to embed cores into ASICs, and the IDK for validation and profiling.

Philips Semiconductors' integration capabilities also include the merging of multiple FPGAs into one ASIC, a lower level integration solution which reduces cost while increasing reliability and speed.

The Infrastructure Development Kit is available now and can be delivered with a baseband development chip.

(This was Electronicstalk's Top Story on 19 February 2002).

Back to top