Logic package is a quarter the size of TSSOP

Philips has developed what it claims to be the world's smallest logic IC package.

Philips has developed what it claims to be the world's smallest logic IC package.

The depopulated very-thin quad flat-pack no-leads (DQFN) package - for logic gates and octal ICs - is meant to address the market needs for smaller electronic products and components.

The DQFN package enhances miniaturisation of the circuit board and frees board space for additional components and functions.

Designed with a footprint of 2.5 by 3mm in a 14-pin configuration, the DQFN package is 75% smaller than existing TSSOPs.

Over the years, package technology has continued to move toward a smaller size with expanded functionality.

Along with higher density ASIC and ASSP solutions, the reduction in package size has contributed to the dramatic miniaturisation of portable and mobile applications.

Building on a long track record of creating new and innovative logic solutions, Philips is taking a decisive lead by being the first to bring the DQFN package to market.

Philips will leverage its strength in manufacturing, test and assembly to meet market demand for this package.

"Daimler Chrysler's Huntsville Electronics facility is designing the next generation of automotive electronic controllers.

With the ever increasing demand to supply these controllers in smaller modules for cost savings and ease of installation in the vehicle, electronic components used on the controllers' printed circuit board had to offer a substantial reduction in size over current surface mount devices, including TSSOP", says Wilman Pidgeon, product engineering supervisor, Huntsville Electronics Facility, Daimler Chrysler.

"This was a critical consideration for selecting components in Philips' DQFN package".

"Philips continues to invest to be a leader in IC package innovation and we have set a new benchmark with the DQFN logic package", said Bruce Potvin, director of marketing, Business Line Logic in the semiconductor division of Philips.

"With the introduction of the DQFN logic IC package, Philips is well-equipped to support customers looking to develop the next-generation products where miniaturisation is essential".

In addition to significant size reduction, the DQFN package also offers improvements in heat dissipation and ease of board assembly.

The package incorporates an exposed die paddle, providing a 20% improvement in heat dissipation over a comparable TSSOP package.

The package does not require leads, thereby eliminating coplanarity and bent-lead issues.

(This was Electronicstalk's Top Story on 10 April 2002).

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