MOSFET package keeps cooler and thinner

The QLPAK is novel miniature power MOSFET package that combines small size with more efficient thermal properties.

The QLPAK is novel miniature power mosfet package that combines small size with more efficient thermal properties.

The package is ideal for use in high-density power applications such as DC/DC convertors for the telecommunications market.

The Philips QLPAK occupies the same 6 x 5mm PCB area as a conventional SO8 package but is thermally far superior.

QLPAK has a thermal resistance of 1.5K/W compared with the SO8 package, which typically has a thermal resistance in excess of 20K/W.

This new package design allows significantly cooler running at any given power level when compared with the industry standard S08 package.

QLPAK is also approximately 50% thinner than the current SO8 package and footprint compatible.

These key benefits combined enables the creation of smaller, cooler and more efficient designs.

"The DC/DC power conversion market is driving ever increasing demands for improved power density and efficiency in package design.

QLPAK addresses customer needs and reinforces Philips' position as a leading developer of application specific power discretes", said David Compton, international product marketing manager, Philips Semiconductors.

"The innovation of QLPAK is a clear example of Philips' technology leadership in essential multimarket semiconductor offerings".

Philips' QLPAK is currently sampling.

Volume production will begin in August 2002.

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