Product category:
Communications ICs (Wireless)
News Release from: NXP Semiconductors | Subject: BGY284
Edited by the Electronicstalk Editorial
Team on 13 February 2003
Power amp handles all four GSM bands
The BGY284 is a highly cost-effective quad-band GSM power amplifier module with a footprint of only 8 x 8mm, a mounting height of 1.5mm and featuring a fully integrated power control loop.
The BGY284 is a highly cost-effective quad-band GSM power amplifier module with a footprint of only 8 x 8mm, a mounting height of 1.5mm and featuring a fully integrated power control loop The BGY284 is designed using a combination of InGaP GaAs, silicon BiCMOS (Philips QUBiC4) and passive component integration (Philips Passi) technologies that maximises circuit performance
This article was originally published on Electronicstalk on 23 Oct 2001 at 8.00am (UK)
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This highly integrated power amplifier is fully compatible with GSM/GPRS-Class 12 and Edge applications and achieves a power-added efficiency of over 55%.
Its low cost, ultra-small size and quad-band (850/900/1800/1900MHz) operation give handset manufacturers a large degree of design freedom to develop smaller lighter handset formats for worldwide GSM markets.
"Because the BGY284 has such a small foot-print and includes an integrated power control loop, manufacturers can save as much as 30% printed circuit board area, and up to 30 external components", said Robbert van der Waal, Marketing Manager for RF power amplifier products at Philips Semiconductors.
The key to the exceptional performance of highly integrated smart power amplifiers such as the BGY284 lies in Philips' approach to PA module design.
Each function within the PA is implemented in a carefully selected technology that optimises its performance, while at the same time leveraging the cost advantages of using a laminate substrate.
To achieve its high power-added efficiency, linearity and breakdown voltage the BGY284 employs an InGaP GaAs HBT for its high power stages, driven by lower power RF drivers and power control circuits integrated in Philips' latest BiCMOS process (QUBiC4) Critical impedance matching networks are designed using Philips' unique Passi technology, enabling low component count and accurate passive devices.
This technology is based on a high-volume silicon process and eliminates the need for expensive ceramic substrates.
Because of its ability to achieve tight component tolerances, Passi produces RF matching networks that out-perform those fabricated on conventional substrate materials, while also allowing the overall PA module to be assembled on low-cost laminate.
Unique construction, a rich feature set and minimal design-in effort make the BGY284 the most cost-effective power amplifier for cellular phones, while also offering the lowest power consumption and component count.
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