Complete Bluetooth system shrinks to one package

The BGB202 SiP is billed as the industry's first complete plug-and-play Bluetooth solution in a single low-cost chip package for applications such as mobile phones, headsets, car kits and PDAs.

The BGB202 system-in-a-package (SiP) is billed as the industry's first complete plug-and-play Bluetooth solution in a single, low-cost chip package for applications such as mobile phones, headsets, car kits and PDAs.

The BGB202 represents a true breakthrough for designers of mobile devices through the integration of multiple technologies into one package, reducing the complete Bluetooth solution footprint to 56mm2.

An evolution of the BGB102 RF SiP announced in June this year, the BGB202 integrates everything needed for Bluetooth wireless technology functionality (radio, baseband, ROM, filters and other discrete components) in one ultrasmall format.

Housed in an HVQFN semiconductor package measuring only 7 x 8mm2, the BGB202 dramatically reduces the number of required components - enabling quicker design cycles, lower risk, simplified manufacturing and a reduced bill of materials (BoM).

"The Bluetooth semiconductor market is poised for volume deployment, initially in Europe and Asia, as pricing and package size have finally dropped to realistic levels", said Ken Furer, IDC Research Analyst, Semiconductors.

A recent IDC report stated that the Bluetooth semiconductor market will grow at an annual rate of 50% to reach $1.46 billion by 2007.

Philips' complete semiconductor Bluetooth system solutions enable wireless technology designers to focus on innovative product designs, instead of spending valuable time on complex RF layout, hardware and software design issues.

The BGB202 is a fully certified plug-and-play Bluetooth system with all the critical RF functions built-in.

This results in an easier and quicker design-in, as no RF-critical experience is required to add Bluetooth functionality.

As a single-package solution, it also simplifies assembly and testing and reduces yield losses.

The BGB202 is offered with proven, state-of-the-art software up to HCI including specific power control features and low power modes.

"As Bluetooth becomes a standard feature in mobile devices, Philips is committed to providing our customers with quality solutions that can be integrated faster, require less board space and power, and are extremely cost effective", said Paul Marino, Vice President and General Manager, Business Line Connectivity, Philips Semiconductors.

"The BGB202 SiP is such a solution - allowing our customers to build better products in less time".

The BGB202 provides Bluetooth short-range wireless connectivity in the globally available ISM band (at frequencies ranging from 2400 to 2483MHz).

Designed for short-range hosted and embedded applications it offers an optimal combination of small size, ease of use and low power consumption for mobile, battery-powered devices.

When combined with the Philips PCF87757 low-voltage voice codec, it can also be used in voice-enabled applications such as headsets and car kits.

Advanced process technologies and packaging techniques optimise size and improve performance of the entire Bluetooth semiconductor range of Philips.

The baseband is manufactured in a cost-effective CMOS technology while the radio subsystem uses an advanced BiCMOS technology to enhance performance.

Passive integration technologies add the loop filter, the antenna filter and other discrete components.

The BGB202 is based on the PCF87852 Blueberry Data ROM baseband IC, which includes an ARM processor, embedded ROM memory, an industry leading Bluetooth core and a variety of interfaces (UART, I2C, PCM/IOM, JTAG).

The radio function of the BGB202 is based on a near-zero IF (N-ZIF) radio transceiver IC, and includes a monolithic antenna filter for enhanced out-of-band blocking performance, a Tx/Rx switch, Tx and Rx baluns, the VCO resonator, and basic supply decoupling.

For the complete SiP, only an external clock source, and an antenna are required for proper operation.

Philips' BGB202 is currently sampling to lead customers and will be available in production quantities in early Q2 2004.

Philips will demonstrate the BGB202 at the PT/Wireless and Networks Comm China 2003 trade show in Beijing, China, 12th-16th November 2003.

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